The fabrication process of semiconductor devices may be classified into the two basic steps of pre-processing and post-processing. In the pre-process procedure, the semiconductor chips are fabricated on the chosen substrate by either crystal growth, lithography, etching, insulator deposition, metal evaporation, etc.

Post-processing is fabrication of actual dedicated devices by wire-bonding and packaging.

POWDEC is primarily concerned with the pre-process procedure. It has proprietary interests in GaN crystal growth. Powdec furnishes foundry services for GaN epitaxial growth.

POWDEC is also concerned with the development of several substrate structures including GaN, AlGaN, GalnN, AlGalnN. These activities are carried out under close collaborations with the customer.